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LoadPort
- It adopts an all-axis stepping motor to move, and it has high reliability in implementation. Accurate chip height information can be obtained by reading the encoder value, which can accurately detect the chip height and the state of the tilted chip when the wafer is positioned. At the same time, when the abnormal thickness and height can be known, the robot can prevent and avoid damage to the chip.
- Both FOUP and Autodoor-FOSB can be handled.
- With proper speed control, the soft opening/closing action can prevent dust from entering the external environment.
- High-concentration N2 Purge (O2<100ppm) can reach high speed within 2 minutes.
- The high cleanliness of the next-generation semiconductor, when the inner door is opened and closed, the non-contact sealing structure (labyrinth or air seal) can inhibit the pollution of the chip by the dust inside the Foup.
- Existing systems can be installed in compliance with SEMI standards or can be replaced with closed doors of existing loading ports. It is effective for mapping CID and E84.
- To accurately identify the storage position of the chip in the FOUP,the following function options can be used.
- CCD Mapping (AI Functional Sensor)
- IR Mapping
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